Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8958214 | Motherboard assembly for interconnecting and distributing signals and power | John L. Colbert, Roger D. Weekly | 2015-02-17 |
| 8952258 | Implementing graphene interconnect for high conductivity applications | Mark D. Plucinski, Thomas S. Thompson | 2015-02-10 |
| 8941398 | Heat spreader flatness detection | Kory W. Weckman | 2015-01-27 |
| 8911244 | Receptacle with heat management for electronic and optical systems | Bret P. Elison, Phillip V. Mann, Arden L. Moore | 2014-12-16 |
| 8779585 | Implementing enhanced thermal conductivity in stacked modules | Kevin M. O'Connell, Kory W. Weckman | 2014-07-15 |
| 8750704 | Implementing reduced signal degradation for fiber optic modules | Joseph Kuczynski | 2014-06-10 |
| 8716597 | Implementing enhanced dimensional stability with graphite nanotube hybrid socket | Phillip V. Mann, Kevin M. O'Connell, Mark D. Plucinski, Sandra J. Shirk/Heath | 2014-05-06 |
| 8705050 | Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer | — | 2014-04-22 |
| 8611090 | Electronic module with laterally-conducting heat distributor layer | Kory W. Weckman | 2013-12-17 |
| 8558564 | Heat spreader flatness detection | Kory W. Weckman | 2013-10-15 |
| 8550840 | Plug and receptacle arrangement with connection sensor | Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath | 2013-10-08 |
| 8544337 | Piezoelectric chromic impact sensor | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2013-10-01 |
| 8446738 | Motherboard assembly for interconnecting and distributing signals and power | John L. Colbert, Roger D. Weekly | 2013-05-21 |
| 8432034 | Use of a local constraint to enhance attachment of an IC device to a mounting platform | Eric V. Kline, Michael R. Rasmussen | 2013-04-30 |
| 8431048 | Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2013-04-30 |
| 8287336 | Method of manufacturing a venting device for tamper resistant electronic modules | John R. Dangler, Phillip Duane Isaacs | 2012-10-16 |
| 8289712 | Flux-free detachable thermal interface between an integrated circuit device and a heat sink | Maurice F. Holahan, Eric V. Kline, Paul N. Krystek, Michael R. Rasmussen, Stephen M. Zins | 2012-10-16 |
| 7944698 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail | 2011-05-17 |
| 7929314 | Method and apparatus of changing PCB pad structure to increase solder volume and strength | Thomas S. Thompson | 2011-04-19 |
| 7903411 | Cold plate stability | Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr. | 2011-03-08 |
| 7832096 | Method for producing an organic substrate with integral thermal dissipation channels | Joseph Kuczynski | 2010-11-16 |
| 7777329 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device | John L. Colbert, John Saunders Corbin, Jr., Jason R. Eagle, Roger Duane Hamilton, Amanda E. Mikhail +1 more | 2010-08-17 |
| 7751918 | Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates | Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr. | 2010-07-06 |
| 7701720 | Electronic assembly and techniques for installing a heatsink in an electronic assembly | John L. Colbert, John Saunders Corbin, Jr., Jason R. Eagle, Christopher L. Tuma | 2010-04-20 |
| 7632127 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail | 2009-12-15 |