Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908847 | Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film | Tatsuyuki Saito, Naofumi Ohashi, Toshinori Imai, Junji Noguchi | 2005-06-21 |
| 6894334 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2005-05-17 |
| 6856019 | Semiconductor integrated circuit device | Kazutoshi Oomori, Noriko Miura, Hideo Aoki, Takayuki Oshima | 2005-02-15 |
| 6853081 | Method for fabricating semiconductor integrated circuit | Yoshitaka Nakamura, Naoki Fukuda, Hidekazu Goto, Isamu Asano, Hideo Aoki +5 more | 2005-02-08 |
| 6818546 | Semiconductor integrated circuit device and a method of manufacturing the same | Tatsuyuki Saito, Naohumi Ohashi, Toshinori Imai, Junji Noguchi | 2004-11-16 |
| 6794308 | Method for reducing by-product deposition in wafer processing equipment | Ming-Jang Hwang, Keizo Hosoda, Shintaro Aoyama, Tadashi Terasaki | 2004-09-21 |
| 6767782 | Manufacturing method of semiconductor device | Takeshi Saikawa, Ryohei Maeno, Sadayuki Okudaira, Tetsuo Saito, Kazutoshi Ohmori | 2004-07-27 |
| 6730613 | Method for reducing by-product deposition in wafer processing equipment | Ming-Jang Hwang, Keizo Hosoda, Shintaro Aoyama, Tadashi Terasaki | 2004-05-04 |
| 6686619 | Dynamic random access memory with improved contact arrangements | Yoshitaka Nakamura, Hideo Aoki, Yoshikazu Ohira, Tadashi Umezawa, Satoru Yamada +5 more | 2004-02-03 |
| 6638811 | Method of manufacturing a semiconductor integrated circuit device having a capacitor | Masayoshi Saito, Yoshitaka Nakamura, Hidekazu Goto, Keizo Kawakita, Satoru Yamada +8 more | 2003-10-28 |
| 6605530 | Method for fabricating semiconductor integrated circuit | Yoshitaka Nakamura, Naoki Fukuda, Hidekazu Goto, Isamu Asano, Hideo Aoki +5 more | 2003-08-12 |
| 6548847 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AND A TRANSITION-METAL NITRIDE FILM BETWEEN THE ALUMINUM WIRING STRIP AND THE TRANSITION-METAL FILM | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2003-04-15 |
| 6492730 | Method for fabricating semiconductor integrated circuit | Yoshitaka Nakamura, Naoki Fukuda, Hidekazu Goto, Isamu Asano, Hideo Aoki +5 more | 2002-12-10 |
| 6399438 | Method of manufacturing semiconductor integrated circuit device having a capacitor | Masayoshi Saito, Yoshitaka Nakamura, Hidekazu Goto, Keizo Kawakita, Satoru Yamada +8 more | 2002-06-04 |
| 6342412 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2002-01-29 |
| 6329681 | Semiconductor integrated circuit device and method of manufacturing the same | Yoshitaka Nakamura, Hideo Aoki, Yoshikazu Ohira, Tadashi Umezawa, Satoru Yamada +5 more | 2001-12-11 |
| 6258649 | Semiconductor integrated circuit device and method of manufacturing the same | Yoshitaka Nakamura, Masayoshi Hirasawa, Isamu Asano, Satoru Yamada, Keizo Kawakita +3 more | 2001-07-10 |
| 6215144 | Semiconductor integrated circuit device, and method of manufacturing the same | Masayoshi Saito, Yoshitaka Nakamura, Hidekazu Goto, Keizo Kawakita, Satoru Yamada +8 more | 2001-04-10 |
| 6169324 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2001-01-02 |
| 6127255 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2000-10-03 |
| 6103566 | Method for manufacturing semiconductor integrated circuit device having a titanium electrode | Shinpei Iijima, Natsuki Yokoyama, Masayuki Nakata | 2000-08-15 |
| 6096597 | Method for fabricating an integrated circuit structure | Robert Tsu, William R. McKee, Shimpei Iijima, Isamu Asano, Masato Kunitomo | 2000-08-01 |
| 6028360 | Semiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium film | Yoshitaka Nakamura, Naoki Fukuda, Hidekazu Goto, Isamu Asano, Hideo Aoki +5 more | 2000-02-22 |
| 5811316 | Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1998-09-22 |
| 5780882 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1998-07-14 |