Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5583375 | Semiconductor device with lead structure within the planar area of the device | Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike, Kazunari Suzuki +7 more | 1996-12-10 |
| 5530286 | Semiconductor device | Gen Murakami, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 1996-06-25 |
| 5466888 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Masazumi Amagai, Ichiro Anjoh, Junichi Arita +2 more | 1995-11-14 |
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Ryoichi Kajiwara, Mituo Katou, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto | 1995-07-11 |
| 5406028 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Masazumi Amagai, Ichiro Anjoh, Junichi Arita +2 more | 1995-04-11 |
| 5378656 | Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same | Yujiro Kajihara, Kazunari Suzuki, Hiromichi Suzuki, Yoshinori Miyaki, Takahiro Naito +1 more | 1995-01-03 |
| 5358904 | Semiconductor device | Gen Murakami, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 1994-10-25 |
| 5068712 | Semiconductor device | Gen Murakami, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 1991-11-26 |
| 4951122 | Resin-encapsulated semiconductor device | Gen Murakami, Toshiyuki Sakuta, Masamichi Ishihara, Satoru Ito, Yasuo Mori | 1990-08-21 |
| 4803543 | Semiconductor device and process for producing the same | Hideo Inayoshi, Akira Suzuki, Toyoichi Ueda, Daisuke Makino, Nobuo Ichimura +1 more | 1989-02-07 |