Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5677045 | Laminate and multilayer printed circuit board | Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii +3 more | 1997-10-14 |
| 5648299 | Packaged semiconductor device and a leadframe therefor | Gen Murakami, Michael A. Lamson, Katherine G. Heinen | 1997-07-15 |
| 5612569 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more | 1997-03-18 |
| 5585665 | Packaged semiconductor device and a leadframe therefor | Gen Murakami, Michael A. Lamson, Katherine G. Heinen | 1996-12-17 |
| 5583375 | Semiconductor device with lead structure within the planar area of the device | Kunihiro Tsubosaki, Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike +7 more | 1996-12-10 |
| 5571428 | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device | Asao Nishimura, Akihiro Yaguchi, Mitsuaki Haneda, Junichi Arita, Akihiko Iwaya +1 more | 1996-11-05 |
| 5569960 | Electronic component, electronic component assembly and electronic component unit | Tetsuo Kumazawa, Makoto Kitano, Akihiro Yaguchi, Ryuji Kohno, Naotaka Tanaka +1 more | 1996-10-29 |
| 5530286 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more | 1996-06-25 |
| 5466888 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Masazumi Amagai, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-11-14 |
| 5442233 | Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation | Gen Murakami, Michael A. Lamson, Katherine G. Heinen | 1995-08-15 |
| 5437915 | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device | Asao Nishimura, Akihiro Yaguchi, Mitsuaki Haneda, Junichi Arita, Akihiko Iwaya +1 more | 1995-08-01 |
| 5406028 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Masazumi Amagai, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-04-11 |
| 5371044 | Method of uniformly encapsulating a semiconductor device in resin | Isamu Yoshida, Junichi Saeki, Shigeharu Tsunoda, Kunihiko Nishi, Kenichi Imura +3 more | 1994-12-06 |
| 5358904 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more | 1994-10-25 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame | Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Ryuji Kohno, Nae Yoneda +1 more | 1994-10-18 |
| 5332922 | Multi-chip semiconductor package | Satoshi Oguchi, Masamichi Ishihara, Kazuya Ito, Gen Murakami, Toshiyuki Sakuta +7 more | 1994-07-26 |
| 5299092 | Plastic sealed type semiconductor apparatus | Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Junichi Arita | 1994-03-29 |
| 5296737 | Semiconductor device with a plurality of face to face chips | Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +1 more | 1994-03-22 |
| 5256903 | Plastic encapsulated semiconductor device | Maya Obata, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Ryuji Kohno +2 more | 1993-10-26 |