Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5109317 | Mounting mechanism for mounting heat sink on multi-chip module | Mitsuo Miyamoto, Shizuo Zushi, Hiroshi Go, Hiroyuki Kojima | 1992-04-28 |
| 5089936 | Semiconductor module | Hiroyuki Kojima, Toshio Hatsuda, Takahiro Daikoku, Shizuo Zushi | 1992-02-18 |
| 5077601 | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system | Toshio Hatada, Takayuki Atarashi, Takahiro Daikoku, Satomi Kobayashi, Shizuo Zushi +1 more | 1991-12-31 |
| 5066235 | Connector assembly for electronic devices | — | 1991-11-19 |
| 5040992 | Mounting structure for electronic device | Mitsuo Miyamoto, Shizuo Zushi, Norio Sengoku, Yoshiaki Horita | 1991-08-20 |
| D314573 | Portable radio telephone set | Kozo Maemura | 1991-02-12 |
| 4970575 | Semiconductor device | Tasao Soga, Hiroaki Hachino, Mamoru Sawahata, Fumio Nakano, Seigou Yukutake | 1990-11-13 |
| 4884170 | Multilayer printed circuit board and method of producing the same | Nobuaki Ohki, Norio Sengoku | 1989-11-28 |
| 4837663 | Electronic apparatus cooling system | Shizuo Zushi, Mitsuo Miyamoto, Hiroshi Gou, Tetsuo Ogata | 1989-06-06 |
| 4836434 | Method and apparatus for airtightly packaging semiconductor package | Takaji Takenaka, Hideki Watanabe | 1989-06-06 |
| 4825284 | Semiconductor resin package structure | Tasao Soga, Marahiro Goda, Fumio Nakano, Tadao Kushima, Nobuyuki Ushifusa +1 more | 1989-04-25 |
| 4776553 | Telephone cradle mount | — | 1988-10-11 |
| 4770242 | Cooling device of semiconductor chips | Takahiro Daikoku, Tadakatsu Nakajima, Noriyuki Ashiwake, Keizo Kawamura, Motohiro Sato +1 more | 1988-09-13 |
| 4739444 | Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components | Shizuo Zushi, Tetsuo Ogata, Mitsuo Miyamoto, Tsutomu Imai | 1988-04-19 |
| 4739125 | Electric component part having lead terminals | Yutaka Watanabe, Masao Sekibata, Shigeo Kuroda, Akio Yasukawa, Shigejiro Sekine | 1988-04-19 |
| 4731703 | Power supply structure and system for mounting the same | Tamotsu Tsukaguchi, Hiroshi Kozai, Toshio Mori | 1988-03-15 |
| D292975 | Combined carrying case and battery pack for a cordless telephone set | — | 1987-12-01 |
| 4649990 | Heat-conducting cooling module | Yasutoshi Kurihara, Tasao Soga, Hiroaki Hachino, Kenji Miyata, Masahiro Okamura +1 more | 1987-03-17 |
| 4651192 | Ceramic packaged semiconductor device | Yasuo Matsushita, Kousuke Nakamura, Mitsuru Ura | 1987-03-17 |
| 4624896 | Multi-layer ceramic substrate and method for the production thereof | Yutaka Watanabe, Satoru Ogihara, Yoshiyuki Ohzawa | 1986-11-25 |
| 4616292 | Multilayer printed circuit board | Norio Sengoku, Hiroshi Kozai | 1986-10-07 |
| 4558395 | Cooling module for integrated circuit chips | Minoru Yamada, Akira Masaki, Masakazu Yamamoto, Keiichirou Nakanishi, Takashi Nishida +2 more | 1985-12-10 |
| 4491562 | Thermal fatigue resistant low-melting point solder alloys | Tasao Soga, Takaya Suzuki, Masahiro Okamura, Masahiro Gooda | 1985-01-01 |