Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4503597 | Method of forming a number of solder layers on a semiconductor wafer | Tadao Kushima, Tasao Soga, Toshitaka Yamamoto | 1985-03-12 |
| 4491562 | Thermal fatigue resistant low-melting point solder alloys | Tasao Soga, Takaya Suzuki, Masahiro Okamura, Fumiyuki Kobayashi | 1985-01-01 |