TS

Tasao Soga

HI Hitachi: 28 patents #1,022 of 28,497Top 4%
RE Renesas Electronics: 3 patents #1,322 of 4,529Top 30%
RT Renesas Technology: 3 patents #990 of 3,337Top 30%
Overall (All Time): #103,736 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #TitleCo-InventorsDate
8907475 Pb-free solder-connected structure Hanae Shimokawa, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more 2014-12-09
8503189 Pb-free solder-connected structure and electronic device Hanae Shimokawa, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more 2013-08-06
8125090 Semiconductor power module Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito, Hanae Shimokawa 2012-02-28
8022551 Solder composition for electronic devices Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more 2011-09-20
8004075 Semiconductor power module including epoxy resin coating Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito, Hanae Shimokawa 2011-08-23
7722962 Solder foil, semiconductor device and electronic device Hanae Hata, Toshiharu Ishida, Tetsuya Nakatsuka, Masahide Okamoto, Kazuma Miura 2010-05-25
7709746 Pb-free solder-connected structure and electronic device Hanae Shimokawa, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more 2010-05-04
7671465 Power semiconductor module Sunao Funakoshi, Katsumi Ishikawa 2010-03-02
7547966 Power semiconductor module Sunao Funakoshi, Katsumi Ishikawa 2009-06-16
7259465 Semiconductor device with lead-free solder Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more 2007-08-21
7145236 Semiconductor device having solder bumps reliably reflow solderable Kazuma Miura, Hanae Shimokawa, Koji Serizawa, Tetsuya Nakatsuka 2006-12-05
7075183 Electronic device Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more 2006-07-11
7013564 Method of producing an electronic device having a PB free solder connection Hanae Shimokawa, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more 2006-03-21
6960396 Pb-free solder-connected structure and electronic device Hanae Shimokawa, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more 2005-11-01
6872465 Solder Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh 2005-03-29
6774490 Electronic device Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more 2004-08-10
6563225 Product using Zn-Al alloy solder Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto, Tetsuya Nakatsuka 2003-05-13
6555052 Electron device and semiconductor device Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more 2003-04-29
6486411 Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Kazuma Miura, Hanae Shimokawa, Koji Serizawa, Tetsuya Nakatsuka 2002-11-26
6204490 Method and apparatus of manufacturing an electronic circuit board Toshiharu Ishida, Tetsuya Nakatsuka, Hanae Shimokawa, Koji Serizawa, Yasuo Amano +2 more 2001-03-20
5942185 Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same Tetsuya Nakatsuka, Hanae Shimokawa, Kenichi Yamamoto, Masahide Harada, Yuuji Ochiai +1 more 1999-08-24
5867809 Electric appliance, printed circuit board, remained life estimation method, and system thereof Hanae Shimokawa, Masahide Harada, Tatsuya Suzuki, Yuji Ochiai, Asao Nakano +2 more 1999-02-02
RE34887 Ceramic multilayer circuit board and semiconductor module Nobuyuki Ushifusa, Hiroichi Shinohara, Kousei Nagayama, Satoru Ogihara 1995-03-28
4970575 Semiconductor device Hiroaki Hachino, Mamoru Sawahata, Fumio Nakano, Fumiyuki Kobayashi, Seigou Yukutake 1990-11-13
4970577 Semiconductor chip module Satoru Ogihara, Shunichi Numata, Kunio Miyazaki, Takashi Yokoyama, Ken Takahashi +3 more 1990-11-13