Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392553 | Drying device and drying method | Kenji Shimosaka, Daisuke Suzuki | 2025-08-19 |
| 8022551 | Solder composition for electronic devices | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima +1 more | 2011-09-20 |
| 7875128 | Method for manufacturing a stainless steel product and a stainless steel product manufactured by the method | Daisuke Kuroda, Shinichi Yanadori, Mitsuo Watanabe | 2011-01-25 |
| 7722962 | Solder foil, semiconductor device and electronic device | Tasao Soga, Hanae Hata, Toshiharu Ishida, Tetsuya Nakatsuka, Masahide Okamoto | 2010-05-25 |
| 7259465 | Semiconductor device with lead-free solder | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima +1 more | 2007-08-21 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable | Hanae Shimokawa, Koji Serizawa, Tasao Soga, Tetsuya Nakatsuka | 2006-12-05 |
| 7075183 | Electronic device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima +1 more | 2006-07-11 |
| 6563225 | Product using Zn-Al alloy solder | Tasao Soga, Toshiharu Ishida, Hanae Hata, Masahide Okamoto, Tetsuya Nakatsuka | 2003-05-13 |
| 6486411 | Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate | Hanae Shimokawa, Koji Serizawa, Tasao Soga, Tetsuya Nakatsuka | 2002-11-26 |