Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244877 | Sealing structure and manufacturing method thereof | Shinya Kawakita, Susumu Ishida, Isamu Yoshida, Osamu Ikeda | 2022-02-08 |
| 8907475 | Pb-free solder-connected structure | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Yoshiharu Inaba +1 more | 2014-12-09 |
| 8699187 | Manufacturing method for a head-stack assembly, apparatus for interconnection of the head-stack assembly, and head-stack assembly | Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Satoshi Kaneko +1 more | 2014-04-15 |
| 8503189 | Pb-free solder-connected structure and electronic device | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Yoshiharu Inaba +1 more | 2013-08-06 |
| 8179631 | Magnetic disk drive feed-through solder connection with solder fillet formed inside base and protruding outside base | Akihiko Aoyagi, Teruhiro Nakamiya, Takashi Kouno, Hitoshi Shindo | 2012-05-15 |
| 8020747 | Soldering method and soldering apparatus | Masato Nakamura | 2011-09-20 |
| 8022551 | Solder composition for electronic devices | Tasao Soga, Hanae Shimokawa, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2011-09-20 |
| 7911062 | Electronic component with varying rigidity leads using Pb-free solder | Koji Serizawa | 2011-03-22 |
| 7722962 | Solder foil, semiconductor device and electronic device | Tasao Soga, Hanae Hata, Toshiharu Ishida, Masahide Okamoto, Kazuma Miura | 2010-05-25 |
| 7709746 | Pb-free solder-connected structure and electronic device | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Yoshiharu Inaba +1 more | 2010-05-04 |
| 7259465 | Semiconductor device with lead-free solder | Tasao Soga, Hanae Shimokawa, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2007-08-21 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable | Kazuma Miura, Hanae Shimokawa, Koji Serizawa, Tasao Soga | 2006-12-05 |
| 7131566 | Packaging method using lead-free solder | Masahide Okamoto, Tomoyuki Ohmura | 2006-11-07 |
| 7075183 | Electronic device | Tasao Soga, Hanae Shimokawa, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2006-07-11 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly | Masahide Okamoto, Tomoyuki Ohmura, Asao Nakano | 2006-05-23 |
| 7013564 | Method of producing an electronic device having a PB free solder connection | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Yoshiharu Inaba +1 more | 2006-03-21 |
| 6960396 | Pb-free solder-connected structure and electronic device | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Yoshiharu Inaba +1 more | 2005-11-01 |
| 6872465 | Solder | Tasao Soga, Hanae Hata, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh | 2005-03-29 |
| 6774490 | Electronic device | Tasao Soga, Hanae Shimokawa, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more | 2004-08-10 |
| 6585149 | Packaging method using lead-free solder | Masahide Okamoto, Tomoyuki Ohmura | 2003-07-01 |
| 6563225 | Product using Zn-Al alloy solder | Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto | 2003-05-13 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Hanae Shimokawa, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more | 2003-04-29 |
| 6486411 | Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate | Kazuma Miura, Hanae Shimokawa, Koji Serizawa, Tasao Soga | 2002-11-26 |
| 6204490 | Method and apparatus of manufacturing an electronic circuit board | Tasao Soga, Toshiharu Ishida, Hanae Shimokawa, Koji Serizawa, Yasuo Amano +2 more | 2001-03-20 |
| 5942185 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same | Tasao Soga, Hanae Shimokawa, Kenichi Yamamoto, Masahide Harada, Yuuji Ochiai +1 more | 1999-08-24 |