Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10481023 | Mechanical quantity measuring device and sensor unit | Hiroyuki Oota, Atsushi Kazama, Shohei Hata, Takuto Yamaguchi, Atsuo SOMA +4 more | 2019-11-19 |
| 10247630 | Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method | Shosaku Ishihara, Atsuo SOMA, Junji Onozuka, Hiroshi Onuki, Daisuke Terada +1 more | 2019-04-02 |
| 8907475 | Pb-free solder-connected structure | Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more | 2014-12-09 |
| 8503189 | Pb-free solder-connected structure and electronic device | Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more | 2013-08-06 |
| 8125090 | Semiconductor power module | Tasao Soga, Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito | 2012-02-28 |
| 8022551 | Solder composition for electronic devices | Tasao Soga, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2011-09-20 |
| 8004075 | Semiconductor power module including epoxy resin coating | Tasao Soga, Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito | 2011-08-23 |
| 7709746 | Pb-free solder-connected structure and electronic device | Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more | 2010-05-04 |
| 7259465 | Semiconductor device with lead-free solder | Tasao Soga, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2007-08-21 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable | Kazuma Miura, Koji Serizawa, Tasao Soga, Tetsuya Nakatsuka | 2006-12-05 |
| 7075183 | Electronic device | Tasao Soga, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2006-07-11 |
| 7013564 | Method of producing an electronic device having a PB free solder connection | Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more | 2006-03-21 |
| 6960396 | Pb-free solder-connected structure and electronic device | Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba +1 more | 2005-11-01 |
| 6774490 | Electronic device | Tasao Soga, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more | 2004-08-10 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more | 2003-04-29 |
| 6486411 | Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate | Kazuma Miura, Koji Serizawa, Tasao Soga, Tetsuya Nakatsuka | 2002-11-26 |
| 6204490 | Method and apparatus of manufacturing an electronic circuit board | Tasao Soga, Toshiharu Ishida, Tetsuya Nakatsuka, Koji Serizawa, Yasuo Amano +2 more | 2001-03-20 |
| 5942185 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same | Tetsuya Nakatsuka, Tasao Soga, Kenichi Yamamoto, Masahide Harada, Yuuji Ochiai +1 more | 1999-08-24 |
| 5867809 | Electric appliance, printed circuit board, remained life estimation method, and system thereof | Tasao Soga, Masahide Harada, Tatsuya Suzuki, Yuji Ochiai, Asao Nakano +2 more | 1999-02-02 |