| 8022551 |
Solder composition for electronic devices |
Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Hirokazu Nakajima +1 more |
2011-09-20 |
| 7468294 |
Semiconductor device and a method of manufacturing the same |
Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Tomio Yamada, Tomomichi Koizumi +1 more |
2008-12-23 |
| 7259465 |
Semiconductor device with lead-free solder |
Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Hirokazu Nakajima +1 more |
2007-08-21 |
| 7075183 |
Electronic device |
Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Hirokazu Nakajima +1 more |
2006-07-11 |
| 7023706 |
Semiconductor device and manufacturing the same |
Hiroki Noto, Tomio Yamada, Tsuneo Endoh |
2006-04-04 |
| 6872465 |
Solder |
Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Hirokazu Nakajima, Tsuneo Endoh |
2005-03-29 |
| 6831360 |
Semiconductor device having an elastic resin with a low modulus of elasticity |
Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Tomio Yamada, Tomomichi Koizumi +1 more |
2004-12-14 |