Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9393645 | Junction material, manufacturing method thereof, and manufacturing method of junction structure | Takuto Yamaguchi, Osamu Ikeda, Hiromitsu Kuroda, Kazuma Kuroki, Shohei Hata +1 more | 2016-07-19 |
| 8525330 | Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer | Osamu Ikeda, Yuki Murasato | 2013-09-03 |
| 8389854 | Metal strip, connector, and method of manufacturing metal strip | Osamu Ikeda | 2013-03-05 |
| 8356742 | Method for manufacturing a semiconductor device using an Al-Zn connecting material | Osamu Ikeda | 2013-01-22 |
| 7722962 | Solder foil, semiconductor device and electronic device | Tasao Soga, Hanae Hata, Toshiharu Ishida, Tetsuya Nakatsuka, Kazuma Miura | 2010-05-25 |
| 7579677 | Semiconductor device and method for manufacturing thereof | Osamu Ikeda, Hidemasa Kagii, Hiroi Oka, Hiroyuki Nakamura | 2009-08-25 |
| 7274103 | Semiconductor device and manufacturing method thereof | Osamu Ikeda, Yukihiro Satou | 2007-09-25 |
| 7256501 | Semiconductor device and manufacturing method of the same | Osamu Ikeda, Akira Muto, Yukihiro Satou | 2007-08-14 |
| 7131566 | Packaging method using lead-free solder | Tetsuya Nakatsuka, Tomoyuki Ohmura | 2006-11-07 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly | Tetsuya Nakatsuka, Tomoyuki Ohmura, Asao Nakano | 2006-05-23 |
| 6774490 | Electronic device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita +4 more | 2004-08-10 |
| 6658733 | Method of manufacturing via interconnection of glass-ceramic wiring board | Norihiro Ami, Shosaku Ishihara, Minoru Tanaka, Mutsumi Horikoshi, Akihiro Yasuda | 2003-12-09 |
| 6585149 | Packaging method using lead-free solder | Tetsuya Nakatsuka, Tomoyuki Ohmura | 2003-07-01 |
| 6563225 | Product using Zn-Al alloy solder | Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Tetsuya Nakatsuka | 2003-05-13 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita +4 more | 2003-04-29 |
| 6384347 | Glass-ceramic wiring board | Norihiro Ami, Shosaku Ishihara, Minoru Tanaka, Mutsumi Horikoshi, Akihiro Yasuda | 2002-05-07 |
| 6248960 | Ceramics substrate with electronic circuit and its manufacturing method | Norihiro Ami, Shosaku Ishihara, Minoru Tanaka, Mutsumi Horikoshi, Akihiro Yasuda | 2001-06-19 |
| 6118671 | Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer | Hirayoshi Tanei, Shoichi Iwanaga, Masato Nakamura, Kousaku Morita, Shousaku Ishihara +4 more | 2000-09-12 |
| 5825632 | Circuit substrate and electronics computer, using sintered glass ceramics | Hirayoshi Tanei, Shoichi Iwanaga, Masato Nakamura, Kousaku Morita, Shousaku Ishihara +4 more | 1998-10-20 |
| 5731066 | Electronic circuit device | Akihiro Ando, Osamu Yamada, Ryohei Satoh, Takashi Inoue, Fumiyuki Kobayashi +2 more | 1998-03-24 |
| 5277723 | Method for producing multilayer ceramic body with convex side faces | Hironori Kodama, Hideo Suzuki, Satoru Ogihara, Tadahiko Moyoshi, Fumiyuki Kobayashi | 1994-01-11 |
| 5097318 | Semiconductor package and computer using it | Akira Tanaka, Kazuji Yamada, Hirokazu Inoue, Hideo Arakawa | 1992-03-17 |