Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9421645 | Solder joint material and method of manufacturing the same | Yuichi Oda, Hideyuki Sagawa, Hiromitsu Kuroda, Kotaro Tanaka, Hiroaki Numata | 2016-08-23 |
| 9393645 | Junction material, manufacturing method thereof, and manufacturing method of junction structure | Takuto Yamaguchi, Masahide Okamoto, Osamu Ikeda, Hiromitsu Kuroda, Shohei Hata +1 more | 2016-07-19 |
| 9255311 | Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method | Hiromitsu Kuroda, Seigi Aoyama, Hiroyoshi Hiruta | 2016-02-09 |
| 8771839 | Composite material | Hiromitsu Kuroda, Tetsuya Tokumitsu | 2014-07-08 |
| 8691395 | Composite material for brazing and a brazed product manufactured using the same | Hideyuki Sagawa, Hiromitsu Kuroda | 2014-04-08 |
| 8669652 | Lead component and method for manufacturing the same, and semiconductor package | Shohei Hata, Yuichi Oda, Hiromitsu Kuroda | 2014-03-11 |
| 7442445 | Brazing clad material, and brazing method and brazing product using the same | Hideyuki Sagawa, Hiromitsu Kuroda, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama +1 more | 2008-10-28 |