JJ

Jack Jau

HM Hermes Microvision: 43 patents #2 of 68Top 3%
AB Asml Netherlands B.V.: 8 patents #564 of 3,192Top 20%
KI Kla Instruments: 3 patents #10 of 99Top 15%
📍 Los Altos Hills, CA: #45 of 812 inventorsTop 6%
🗺 California: #6,736 of 386,348 inventorsTop 2%
Overall (All Time): #45,665 of 4,157,543Top 2%
55
Patents All Time

Issued Patents All Time

Showing 26–50 of 55 patents

Patent #TitleCo-InventorsDate
8937281 Method for examining a sample by using a charged particle beam Yan Zhao, Wei Fang 2015-01-20
8923601 Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof Wei Fang, Hong Xiao 2014-12-30
8884224 Charged particle beam imaging assembly and imaging method thereof Wei Fang, Yan Zhao 2014-11-11
8805054 Method and system of classifying defects on a wafer Wei Fang, Zhao-Li Zhang 2014-08-12
8791414 Dynamic focus adjustment with optical height detection apparatus in electron beam system Joe Wang, Van-Duc Nguyen, Yi Wang, Zhongwei Chen 2014-07-29
8748815 Method and system for detecting or reviewing open contacts on a semiconductor device Frederick Y. Zhao 2014-06-10
8748814 Structure for inspecting defects in word line array fabricated by SADP process and method thereof Hong Xiao 2014-06-10
8712184 Method and system for filtering noises in an image scanned by charged particles Chad Liao, Futang Peng, Chuan Li, Alina Wang, Zhao-Li Zhang +1 more 2014-04-29
8692214 Charged particle beam inspection method Yan Zhao 2014-04-08
8606017 Method for inspecting localized image and system thereof Wei Fang, Zhao-Li Zhang 2013-12-10
8432441 Method and system for measuring critical dimension and monitoring fabrication uniformity Wei Fang, Hong Xiao 2013-04-30
8299431 Method for examining a sample by using a charged particle beam Yan Zhao, Wei Fang 2012-10-30
8294094 Method and apparatus for reducing substrate edge effect during inspection Yan Zhao, Yi Wang 2012-10-23
8094924 E-beam defect review system Zhongwei Chen, Yi Wang, Chung-Shih Pan, Joe Wang, Xuedong Liu +2 more 2012-01-10
8089297 Structure and method for determining a defect in integrated circuit manufacturing process Hong Xiao, Chang-Chun Yeh 2012-01-03
8068662 Method and system for determining a defect during charged particle beam inspection of a sample Zhao-Li Zhang, Wei Fang 2011-11-29
8055059 Method and system for determining a defect during sample inspection involving charged particle beam imaging Wei Fang 2011-11-08
8050490 Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof Hong Xiao, Wei Fang 2011-11-01
8010307 In-line overlay measurement using charged particle beam system Wei Fang, Hong Xiao 2011-08-30
7973283 Method for regulating scanning sample surface charge in continuous and leap-and-scan scanning mode imaging process Joe Wang 2011-07-05
7919760 Operation stage for wafer edge inspection and review Hong Xiao, Joe Wang, Zhongwei Chen, Yi Wang, Edward Tseng 2011-04-05
7884334 Charged particle beam imaging method and system thereof Yan Zhao 2011-02-08
7474001 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing Yan Zhao, Chang-Chun Yeh, Zhong-Wei Chen 2009-01-06
7105436 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing Yan Zhao, Chang-Chun Yeh, Zhong-Wei Chen 2006-09-12
6881956 Method and apparatus for scanning semiconductor wafers using a scanning electron microscope Zhongwei Chen 2005-04-19