| 9590056 |
Semiconductor device comprising contact structures with protection layers formed on sidewalls of contact etch stop layers |
Kai Frohberg, Katrin Reiche |
2017-03-07 |
| 9269809 |
Methods for forming protection layers on sidewalls of contact etch stop layers |
Kai Frohberg, Katrin Reiche |
2016-02-23 |
| 9023696 |
Method of forming contacts for devices with multiple stress liners |
Peter Baars, Thilo Scheiper |
2015-05-05 |
| 9023709 |
Top corner rounding by implant-enhanced wet etching |
Hans-Peter Moll, Werner Graf |
2015-05-05 |
| 8883586 |
Mol insitu Pt rework sequence |
Peter Baars, Uwe Kahler, Vivien Schroeder |
2014-11-11 |
| 8673696 |
SOI semiconductor device comprising a substrate diode with reduced metal silicide leakage |
Peter Baars, Frank Jakubowski, Jens Heinrich, Jana Schlott, Kai Frohberg |
2014-03-18 |
| 8293605 |
Methods for fabricating a CMOS integrated circuit having a dual stress layer (DSL) |
Peter Baars, Clemens Fitz |
2012-10-23 |
| 7785935 |
Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device |
Ole Bosholm, Goetz Springer, Detlef Weber, Grit Bonsdorf, Frank Pietzschmann |
2010-08-31 |
