Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7235866 | Low dielectric constant film material, film and semiconductor device using such material | Shun-ichi Fukuyama, Katsumi Suzuki, Ei Yano, Tamotsu Owada, Iwao Sugiura | 2007-06-26 |
| 7232769 | Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating film | Akira Nakashima, Miki Egami, Michio Komatsu, Ei Yano, Katsumi Suzuki | 2007-06-19 |
| 7170177 | Semiconductor apparatus | Katsumi Suzuki, Iwao Sugiura, Ei Yano | 2007-01-30 |
| 7148308 | One-part moisture-curing urethane composition | Atsushi Inoue, Yoshinori Mayama | 2006-12-12 |
| 6958525 | Low dielectric constant film material, film and semiconductor device using such material | Shun-ichi Fukuyama, Katsumi Suzuki, Ei Yano, Tamotsu Owada, Iwao Sugiura | 2005-10-25 |
| 6780498 | Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film | Katsumi Suzuki, Iwao Sugiura, Ei Yano | 2004-08-24 |
| 6727515 | Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device | Katsumi Suzuki, Iwao Sugiura, Ei Yano | 2004-04-27 |
| 6657035 | Moisture-curable one-pack-type urethane adhesive composition | Shinji Ochi | 2003-12-02 |
| 6613834 | Low dielectric constant film material, film and semiconductor device using such material | Shun-ichi Fukuyama, Katsumi Suzuki, Ei Yano, Tamotsu Owada, Iwao Sugiura | 2003-09-02 |
| 6348123 | Method for adhering polyolefin materials | Shinji Ochi | 2002-02-19 |
| 5976703 | Material and method for planarization of substrate | Shyun-ichi Fukuyama, Michiko Katayama, Joe Yamaguchi, Hideki Harada, Yoshiyuki Ohkura | 1999-11-02 |
| 5949130 | Semiconductor integrated circuit device employing interlayer insulating film with low dielectric constant | Shun-ichi Fukuyama, Azuma Matsuura, Tomoaki Hayano | 1999-09-07 |
| 5770260 | Process for forming silicon dioxide film | Shun-ichi Fukuyama, Daitei Shin, Yuki Komatsu, Hideki Harada, Michiko Kobayashi +1 more | 1998-06-23 |
| 5763540 | Epoxy resin composition for encapsulating semiconductor | Yukio Takigawa, Shigeaki Yagi, Norio Sawatari | 1998-06-09 |
| 5659004 | Epoxy resin composition | Yukio Takigawa, Shigeaki Yagi, Norio Sawatari, Nobuo Kamehara | 1997-08-19 |
| 5602060 | Process for the production of semiconductor devices | Michiko Kobayashi, Syun-ichi Fukuyama, Masanori Naitou, Hiroshi Kudo, Yoshiyuki Ohkura | 1997-02-11 |
| 5459185 | One-part moisture-curing orethane adhesive | Masaharu Takada, Yukio Hayashi | 1995-10-17 |
| 5304623 | One-pack type heat precurable moisture-curing sealant composition comprising isocyanate containing component and siloxane containing polyol | Masahiro Ito, Yukio Hayashi | 1994-04-19 |
| 5204391 | Blocked polyisocyanurate and polyvinyl chloride plastisol composition containing the same | Hirohide Tomoyasu | 1993-04-20 |
| 5034453 | Moisture-curing hot-melt sealant | Masaharu Takada | 1991-07-23 |
| 4983655 | Blocked polyisocyanurate compound and plastisol composition containing same | Tadao Kunishige | 1991-01-08 |
| 4804710 | Epoxy resin composition | Tadao Kunishige | 1989-02-14 |