GM

Gaetan L. Mathieu

FO Formfactor: 153 patents #2 of 177Top 2%
TE Tessera: 8 patents #54 of 271Top 20%
BL Berkeley Lights: 7 patents #15 of 97Top 20%
FS Fairchild Semiconductor: 2 patents #274 of 715Top 40%
University of California: 2 patents #4,561 of 18,278Top 25%
📍 Varennes, CA: #1 of 84 inventorsTop 2%
Overall (All Time): #4,518 of 4,157,543Top 1%
175
Patents All Time

Issued Patents All Time

Showing 51–75 of 175 patents

Patent #TitleCo-InventorsDate
7463043 Methods of probing an electronic device Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens 2008-12-09
7458816 Shaped spring Benjamin N. Eldridge, Stuart Wenzel 2008-12-02
7444253 Air bridge structures and methods of making and using air bridge structures 2008-10-28
7435108 Variable width resilient conductive contact structures Benjamin N. Eldridge 2008-10-14
7400157 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Poya Lotfizadeh, Chih-Chiang Tseng 2008-07-15
7371072 Spring interconnect structures Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder 2008-05-13
7347702 Contact carriers (tiles) for populating larger substrates with spring contacts Benjamin N. Eldridge, Thomas H. Dozier, II, Igor Y. Khandros, William D. Smith 2008-03-25
7330039 Method for making a socket to perform testing on integrated circuits Igor Y. Khandros, Carl V. Reynolds 2008-02-12
7325302 Method of forming an interconnection element Benjamin N. Eldridge 2008-02-05
7312618 Method and system for compensating thermally induced motion of probe cards Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde 2007-12-25
7287322 Lithographic contact elements Benjamin N. Eldridge, Gary W. Grube 2007-10-30
7285968 Apparatus and method for managing thermally induced motion of a probe card assembly Benjamin N. Eldridge, Gary W. Grube, Eric D. Hobbs, Makarand Shinde, Alexander H. Slocum +2 more 2007-10-23
7262611 Apparatuses and methods for planarizing a semiconductor contactor Benjamin N. Eldridge, Gary W. Grube 2007-08-28
7251884 Method to build robust mechanical structures on substrate surfaces Gary W. Grube, Benjamin N. Eldridge, Chadwick D. Sofield 2007-08-07
7230437 Mechanically reconfigurable vertical tester interface for IC probing Benjamin N. Eldridge, Barbara Vasquez, Makarand Shinde, A. Nicholas Sporck 2007-06-12
7225538 Resilient contact structures formed and then attached to a substrate Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros 2007-06-05
7218127 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens 2007-05-15
7202682 Composite motion probing Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens 2007-04-10
7200930 Probe for semiconductor devices Igor Y. Khandros 2007-04-10
7196531 Method of manufacturing a probe card Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Poya Lotfizadeh, Jim Chih-Chiang Tseng 2007-03-27
7168162 Method of manufacturing a probe card Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge 2007-01-30
7140883 Contact carriers (tiles) for populating larger substrates with spring contacts Igor Y. Khandros, Benjamin N. Eldridge, Thomas H. Dozier, II, William D. Smith 2006-11-28
7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros 2006-11-28
7127811 Methods of fabricating and using shaped springs Benjamin N. Eldridge, Stuart Wenzel 2006-10-31
7122760 Using electric discharge machining to manufacture probes Benjamin N. Eldridge, Gary W. Grube 2006-10-17