Issued Patents All Time
Showing 76–100 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7119564 | Method and system for compensating thermally induced motion of probe cards | Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder +1 more | 2006-10-10 |
| 7086149 | Method of making a contact structure with a distinctly formed tip structure | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 2006-08-08 |
| 7084656 | Probe for semiconductor devices | Igor Y. Khandros | 2006-08-01 |
| 7073254 | Method for mounting a plurality of spring contact elements | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 2006-07-11 |
| 7071714 | Method and system for compensating for thermally induced motion of probe cards | Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde | 2006-07-04 |
| 7063541 | Composite microelectronic spring structure and method for making same | Gary W. Grube, Igor Y. Khandros | 2006-06-20 |
| 7059047 | Sockets for “springed” semiconductor devices | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, David V. Pedersen +1 more | 2006-06-13 |
| 7048548 | Interconnect for microelectronic structures with enhanced spring characteristics | Benjamin N. Eldridge | 2006-05-23 |
| 7047638 | Method of making microelectronic spring contact array | Benjamin N. Eldridge, Carl V. Reynolds | 2006-05-23 |
| 7024763 | Methods for making plated through holes usable as interconnection wire or probe attachments | Igor Y. Khandros, Carl V. Reynolds | 2006-04-11 |
| 7010854 | Re-assembly process for MEMS structures | Benjamin N. Eldridge | 2006-03-14 |
| 7002363 | Method and system for compensating thermally induced motion of probe cards | — | 2006-02-21 |
| 6972578 | Method and system for compensating thermally induced motion of probe cards | Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder +1 more | 2005-12-06 |
| 6956174 | Tip structures | Igor Y. Khandros | 2005-10-18 |
| 6945827 | Microelectronic contact structure | Gary W. Grube, Alec Madsen | 2005-09-20 |
| 6937037 | Probe card assembly for contacting a device with raised contact elements | Benjamin N. Eldridge, Gary W. Grube | 2005-08-30 |
| 6920689 | Method for making a socket to perform testing on integrated circuits | Igor Y. Khandros, Carl V. Reynolds | 2005-07-26 |
| 6913468 | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 2005-07-05 |
| 6888229 | Connection components with frangible leads and bus | Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Jason Sweis, Laurie Union +1 more | 2005-05-03 |
| 6864105 | Method of manufacturing a probe card | Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Poya Lotfizadeh, Chih-Chiang Tseng | 2005-03-08 |
| 6840374 | Apparatus and method for cleaning test probes | Igor Y. Khandros, Benjamin N. Eldridge, Treliant Fang, Gary W. Grube, Michael A. Drush +1 more | 2005-01-11 |
| 6836962 | Method and apparatus for shaping spring elements | Igor Y. Khandros, Thomas H. Dozier, II, Gary W. Grube | 2005-01-04 |
| 6835898 | ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 2004-12-28 |
| 6827584 | Interconnect for microelectronic structures with enhanced spring characteristics | Benjamin N. Eldridge | 2004-12-07 |
| 6825422 | Interconnection element with contact blade | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen | 2004-11-30 |