Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7173035 | Arylsulfonamide compounds | Ulf Bremberg, Patrizia Caldirola, Annika Jensen, Lori Sutin, Andrew Mott +1 more | 2007-02-06 |
| 7144883 | Bicyclic sulfonamide compounds | Patrizia Caldirola, Andrew Mott, Katarina Beierlien, Markus Thor, Lars Tedenborg +2 more | 2006-12-05 |
| 7087750 | Compounds, their use and preparation | Patrizia Caldirola, Bjorn Nilsson | 2006-08-08 |
| 6969710 | Compounds | Ulf Bremberg, Patrizia Caldirola, Annika Jensen, Andrew Mott, Lori Sutin +1 more | 2005-11-29 |
| 6835533 | Photoimageable dielectric epoxy resin system film | Elizabeth Foster, Heike Marcello, David J. Russell | 2004-12-28 |
| 6830875 | Forming a through hole in a photoimageable dielectric structure | Stephen Joseph Fuerniss, Ross W. Keesler, John M. Lauffer, Voya R. Markovich, Peter A. Moschak +2 more | 2004-12-14 |
| 6794040 | Flowable compositions and use in filling vias and plated through-holes | Konstantinos I. Papathomas | 2004-09-21 |
| 6734569 | Die attachment with reduced adhesive bleed-out | Bernd Karl Appelt, Konstantinos I. Papathomas | 2004-05-11 |
| 6706464 | Method of fabricating circuitized structures | Elizabeth Foster, Heike Marcello, David J. Russell | 2004-03-16 |
| 6534245 | Process for filling apertures in a circuit board or chip carrier | Bernd Karl Appelt, Konstantinos I. Papathomas | 2003-03-18 |
| 6528218 | Method of fabricating circuitized structures | Elizabeth Foster, Heike Marcello, David J. Russell | 2003-03-04 |
| 6521844 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Stephen Joseph Fuerniss, Ross W. Keesler, John M. Lauffer, Voya R. Markovich, Peter A. Moschak +2 more | 2003-02-18 |
| 6427325 | Flowable compositions and use in filling vias and plated through-holes | Konstantinos I. Papathomas | 2002-08-06 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2002-07-16 |
| 6337375 | High optical contrast resin composition and electronic package utilizing same | Konstantinos I. Papathomas | 2002-01-08 |
| 6252307 | Structure for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2001-06-26 |
| 6225031 | Process for filling apertures in a circuit board or chip carrier | Bernd Karl Appelt, Konstantinos I. Papathomas | 2001-05-01 |
| 6190759 | High optical contrast resin composition and electronic package utilizing same | Konstantinos I. Papathomas | 2001-02-20 |
| 6090474 | Flowable compositions and use in filling vias and plated through-holes | Konstantinos I. Papathomas | 2000-07-18 |
| 5599937 | Heteroaromatic quinuclidinenes, their use and preparation | Gunilla Glas, Uli A. Hacksell, Bj orn Nilsson, Lisbeth Nilvebrant, Gunnar Nordvall | 1997-02-04 |
| 4983332 | Method for manufacturing hydrophilic contact lenses | Dennis Hahn, Dominic V. Ruscio, Christopher E. Blank | 1991-01-08 |