AO

Akira Owatari

EB Ebara: 13 patents #164 of 1,611Top 15%
Overall (All Time): #370,847 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12157951 Plating method, insoluble anode for plating, and plating apparatus Hiroyuki Kanda, Naoki Shimomura, Mizuki Nagai, Shingo Yasuda 2024-12-03
11566339 Plating method and plating apparatus Yusuke Tamari, Mizuki Nagai, Shingo Yasuda 2023-01-31
10941504 Plating method and plating apparatus Yusuke Tamari, Mizuki Nagai, Shingo Yasuda 2021-03-09
10294580 Plating method and plating apparatus Yusuke Tamari, Mizuki Nagai, Shingo Yasuda 2019-05-21
10294581 Plating method Shingo Yasuda 2019-05-21
9708724 Anode unit and plating apparatus having such anode unit Junichiro Tsujino, Tsutomu Nakada, Yusuke Tamari, Mitsutoshi Yahagi 2017-07-18
7878144 Electroless plating apparatus and electroless plating method Yasuhiko Saijo, Junichiro Tsujino 2011-02-01
7575636 Substrate processing apparatus and substrate processing method Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa +4 more 2009-08-18
7498261 Method and apparatus for forming metal film Xinming Wang, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga 2009-03-03
7442257 Substrate processing apparatus and substrate processing method Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa +4 more 2008-10-28
7285492 Method for processing substrate Xinming Wang, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga +2 more 2007-10-23
7087117 Substrate processing apparatus and substrate processing method Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa +4 more 2006-08-08
6824613 Substrate processing apparatus Naoki Dai, Masaya Seki, Akihiro Yazawa, Toshio Yokoyama 2004-11-30