Issued Patents All Time
Showing 101–104 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6590282 | Stacked semiconductor package formed on a substrate and method for fabrication | Hsing-Seng Wang, Rong-Shen Lee | 2003-07-08 |
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chung-Tao Chang, Kuo-Chuan Chen | 2002-09-03 |
| 6218726 | Built-in stress pattern on IC dies and method of forming | Chung-Tao Chang, Hsin-Chien Huang | 2001-04-17 |
| 5583263 | Process of making ketones | Duraisamy Muthusamy, Richard Dale Swain, David B. Litzen, William Ridley Pledger | 1996-12-10 |