Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8324723 | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump | Charles W. C. Lin | 2012-12-04 |
| 8324653 | Semiconductor chip assembly with ceramic/metal substrate | Charles W. C. Lin | 2012-12-04 |
| 8314438 | Semiconductor chip assembly with bump/base heat spreader and cavity in bump | Charles W. C. Lin | 2012-11-20 |
| 8310043 | Semiconductor chip assembly with post/base heat spreader with ESD protection layer | Charles W. C. Lin | 2012-11-13 |
| 8304292 | Method of making a semiconductor chip assembly with a ceramic/metal substrate | Charles W. C. Lin | 2012-11-06 |
| 8298868 | Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole | Charles W. C. Lin | 2012-10-30 |
| 8288792 | Semiconductor chip assembly with post/base/post heat spreader | Charles W. C. Lin | 2012-10-16 |
| 8283211 | Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump | Charles W. C. Lin | 2012-10-09 |
| 8269336 | Semiconductor chip assembly with post/base heat spreader and signal post | Charles W. C. Lin | 2012-09-18 |
| 8241962 | Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity | Charles W. C. Lin, Sangwhoo Lim | 2012-08-14 |
| 8236618 | Method of making a semiconductor chip assembly with a post/base/post heat spreader | Charles W. C. Lin | 2012-08-07 |
| 8236619 | Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace | Charles W. C. Lin | 2012-08-07 |
| 8232576 | Semiconductor chip assembly with post/base heat spreader and ceramic block in post | Charles W. C. Lin, Sangwhoo Lim | 2012-07-31 |
| 8232573 | Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace | Charles W. C. Lin | 2012-07-31 |
| 8227270 | Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal | Charles W. C. Lin | 2012-07-24 |
| 8212279 | Semiconductor chip assembly with post/base heat spreader, signal post and cavity | Charles W. C. Lin, Sangwhoo Lim | 2012-07-03 |
| 8207553 | Semiconductor chip assembly with base heat spreader and cavity in base | Charles W. C. Lin, Sangwhoo Lim | 2012-06-26 |
| 8207019 | Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts | Charles W. C. Lin | 2012-06-26 |
| 8203167 | Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal | Charles W. C. Lin | 2012-06-19 |
| 8193556 | Semiconductor chip assembly with post/base heat spreader and cavity in post | Charles W. C. Lin, Sangwhoo Lim | 2012-06-05 |
| 8178395 | Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via | Charles W. C. Lin, Ming-Yu Shih | 2012-05-15 |
| 8163603 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding | Charles W. C. Lin | 2012-04-24 |
| 8153477 | Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader | Charles W. C. Lin | 2012-04-10 |
| 8148207 | Method of making a semiconductor chip assembly with a post/base/cap heat spreader | Charles W. C. Lin, David M. Sigmond | 2012-04-03 |
| 8148747 | Semiconductor chip assembly with post/base/cap heat spreader | Charles W. C. Lin, David M. Sigmond | 2012-04-03 |