Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318411 | Semiconductor package with package-on-package stacking capability and method of manufacturing the same | Charles W. C. Lin | 2016-04-19 |
| 9299651 | Semiconductor assembly and method of manufacturing the same | Charles W. C. Lin | 2016-03-29 |
| 9230901 | Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same | Charles W. C. Lin | 2016-01-05 |
| 9209154 | Semiconductor package with package-on-package stacking capability and method of manufacturing the same | Charles W. C. Lin | 2015-12-08 |
| 9147587 | Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same | Charles W. C. Lin | 2015-09-29 |
| 9147667 | Semiconductor device with face-to-face chips on interposer and method of manufacturing the same | Charles W. C. Lin | 2015-09-29 |
| 9087847 | Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same | Charles W. C. Lin | 2015-07-21 |
| 9064878 | Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device | Charles W. C. Lin | 2015-06-23 |
| 9018667 | Semiconductor chip assembly with post/base heat spreader and dual adhesives | Charles W. C. Lin, Sangwhoo Lim | 2015-04-28 |
| 8952526 | Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry | Charles W. C. Lin | 2015-02-10 |
| 8927339 | Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry | Charles W. C. Lin | 2015-01-06 |
| 8901435 | Hybrid wiring board with built-in stopper, interposer and build-up circuitry | Charles W. C. Lin | 2014-12-02 |
| 8895380 | Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby | Charles W. C. Lin | 2014-11-25 |
| 8865525 | Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby | Charles W. C. Lin | 2014-10-21 |
| 8841171 | Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry | Charles W. C. Lin | 2014-09-23 |
| 8614502 | Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device | Charles W. C. Lin | 2013-12-24 |
| 8535985 | Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump | Charles W. C. Lin | 2013-09-17 |
| 8531024 | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace | Charles W. C. Lin | 2013-09-10 |
| 8525214 | Semiconductor chip assembly with post/base heat spreader with thermal via | Charles W. C. Lin, Ming-Yu Shih | 2013-09-03 |
| 8415703 | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange | Charles W. C. Lin, Sangwhoo Lim | 2013-04-09 |
| 8378372 | Semiconductor chip assembly with post/base heat spreader and horizontal signal routing | Charles W. C. Lin | 2013-02-19 |
| 8354688 | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump | Charles W. C. Lin | 2013-01-15 |
| 8354283 | Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump | Charles W. C. Lin | 2013-01-15 |
| 8343808 | Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry | Charles W. C. Lin | 2013-01-01 |
| 8329510 | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer | Charles W. C. Lin | 2012-12-11 |