Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129742 | Semiconductor chip assembly with post/base heat spreader and plated through-hole | Charles W. C. Lin | 2012-03-06 |
| 8110446 | Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace | Charles W. C. Lin | 2012-02-07 |
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post | Charles W. C. Lin, Sangwhoo Lim | 2011-12-13 |
| 8067270 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate | Charles W. C. Lin | 2011-11-29 |
| 8067784 | Semiconductor chip assembly with post/base heat spreader and substrate | Charles W. C. Lin | 2011-11-29 |
| 8062912 | Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing | Charles W. C. Lin | 2011-11-22 |
| 8034645 | Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader | Charles W. C. Lin | 2011-10-11 |
| 8003415 | Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing | Charles W. C. Lin | 2011-08-23 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives | Charles W. C. Lin, Sangwhoo Lim | 2011-08-23 |
| 7951622 | Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post | Charles W. C. Lin | 2011-05-31 |
| 7948076 | Semiconductor chip assembly with post/base heat spreader and vertical signal routing | Charles W. C. Lin | 2011-05-24 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post | Charles W. C. Lin, Sangwhoo Lim | 2011-05-10 |
| 7901993 | Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace | Charles W. C. Lin | 2011-03-08 |
| 7811863 | Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment | Charles W. C. Lin, David M. Sigmond | 2010-10-12 |
| 7656031 | Stackable semiconductor package having metal pin within through hole of package | Cheng-Chung Chen, Chin Hock Tan, Charles W. C. Lin | 2010-02-02 |
| 7494843 | Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding | Charles W. C. Lin | 2009-02-24 |
| 7446419 | Semiconductor chip assembly with welded metal pillar of stacked metal balls | Charles W. C. Lin | 2008-11-04 |
| 7419851 | Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal | Charles W. C. Lin | 2008-09-02 |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal | Charles W. C. Lin | 2008-08-19 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar | Charles W. C. Lin | 2008-01-15 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal | Charles W. C. Lin | 2007-06-19 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar | Charles W. C. Lin | 2007-06-19 |
| 7075186 | Semiconductor chip assembly with interlocked contact terminal | Charles W. C. Lin | 2006-07-11 |
| 6876072 | Semiconductor chip assembly with chip in substrate cavity | Charles W. C. Lin | 2005-04-05 |
| 6872591 | Method of making a semiconductor chip assembly with a conductive trace and a substrate | Charles W. C. Lin | 2005-03-29 |