Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9018667 | Semiconductor chip assembly with post/base heat spreader and dual adhesives | Charles W. C. Lin, Chia-Chung Wang | 2015-04-28 |
| 8415703 | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange | Charles W. C. Lin, Chia-Chung Wang | 2013-04-09 |
| 8241962 | Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity | Charles W. C. Lin, Chia-Chung Wang | 2012-08-14 |
| 8232576 | Semiconductor chip assembly with post/base heat spreader and ceramic block in post | Charles W. C. Lin, Chia-Chung Wang | 2012-07-31 |
| 8212279 | Semiconductor chip assembly with post/base heat spreader, signal post and cavity | Charles W. C. Lin, Chia-Chung Wang | 2012-07-03 |
| 8207553 | Semiconductor chip assembly with base heat spreader and cavity in base | Charles W. C. Lin, Chia-Chung Wang | 2012-06-26 |
| 8193556 | Semiconductor chip assembly with post/base heat spreader and cavity in post | Charles W. C. Lin, Chia-Chung Wang | 2012-06-05 |
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post | Charles W. C. Lin, Chia-Chung Wang | 2011-12-13 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives | Charles W. C. Lin, Chia-Chung Wang | 2011-08-23 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post | Charles W. C. Lin, Chia-Chung Wang | 2011-05-10 |