Issued Patents All Time
Showing 101–124 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9047938 | Phase change memory management | Mukta G. Farooq, Gary W. Maier, Bipin Rajendran | 2015-06-02 |
| 8959224 | Network data packet processing | Claude Basso, Jean Calvignac, Hubertus Franke | 2015-02-17 |
| 8874893 | Effect translation and assessment among microarchitecture components | Bulent Abali, Michael Stephen Floyd | 2014-10-28 |
| 8856321 | System to improve operation of a data center with heterogeneous computing clouds | Madhusudan K. Iyengar, Vinod Kamath, Roger R. Schmidt | 2014-10-07 |
| 8796047 | Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip | Pradip Bose, Jude A. Rivers, Victor Zyuban | 2014-08-05 |
| 8679861 | Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip | Pradip Bose, Jude A. Rivers, Victor Zyuban | 2014-03-25 |
| 8677613 | Enhanced modularity in heterogeneous 3D stacks | Philip G. Emma, Jude A. Rivers | 2014-03-25 |
| 8595731 | Low overhead dynamic thermal management in many-core cluster architecture | Pradip Bose, Philip G. Emma, Jude A. Rivers | 2013-11-26 |
| 8571847 | Efficiency of static core turn-off in a system-on-a-chip with variation | Chen-Yong Cher, Paul W. Coteus, Alan Gara, David P. Paulsen, Brian Andrew Schuelke +2 more | 2013-10-29 |
| 8549363 | Reliability and performance of a system-on-a-chip by predictive wear-out based activation of functional components | Chen-Yong Cher, Paul W. Coteus, Alan Gara, David P. Paulsen, Brian Andrew Schuelke +2 more | 2013-10-01 |
| 8542030 | Three-dimensional (3D) stacked integrated circuit testing | Chen-Yong Cher, Gary W. Maier, Raphael P. Robertazzi | 2013-09-24 |
| 8543959 | Bonding controller guided assessment and optimization for chip-to-chip stacking | Gary Dale Carpenter, Alan J. Drake | 2013-09-24 |
| 8516426 | Vertical power budgeting and shifting for three-dimensional integration | Pradip Bose, Gary Dale Carpenter, Michael Stephen Floyd, Phillip J. Restle, Michael R. Scheuermann | 2013-08-20 |
| 8489217 | Thermal cycling and gradient management in three-dimensional stacked architectures | Chen-Yong Cher, Wilfried E. Haensch, David R. Motschman | 2013-07-16 |
| 8473762 | Power delivery in a heterogeneous 3-D stacked apparatus | Robert H. Dennard | 2013-06-25 |
| 8424006 | Task assignment on heterogeneous three-dimensional/stacked microarchitectures | Hans M. Jacobson | 2013-04-16 |
| 8417917 | Processor core stacking for efficient collaboration | Philip G. Emma, Moinuddin K. Qureshi, Vijayalakshmi Srinivasan | 2013-04-09 |
| 8386859 | On-chip non-volatile storage of a test-time profile for efficiency and performance control | Philip G. Emma, Stephen M. Gates | 2013-02-26 |
| 8296773 | Systems and methods for thread assignment and core turn-off for integrated circuit energy efficiency and high-performance | Pradip Bose, Alper Buyuktosunoglu | 2012-10-23 |
| 8276002 | Power delivery in a heterogeneous 3-D stacked apparatus | Robert H. Dennard | 2012-09-25 |
| 8276018 | Non-volatile memory based reliability and availability mechanisms for a computing device | Philip G. Emma, Stephen M. Gates | 2012-09-25 |
| 8141020 | Temperature-controlled 3-dimensional bus placement | Philip G. Emma, Jude A. Rivers | 2012-03-20 |
| 7886172 | Method of virtualization and OS-level thermal management and multithreaded processor with virtualization and OS-level thermal management | Pradip Bose, Chen-Yong Cher, Hubertus Franke, Hendrik F. Hamann, Alan J. Weger | 2011-02-08 |
| 7487012 | Methods for thermal management of three-dimensional integrated circuits | Pradip Bose, Alper Buyuktosunoglu | 2009-02-03 |