Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6517416 | Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher | Annette M. Crevasse, John A. Maze, Frank Miceli | 2003-02-11 |
| 6518987 | Mouse and mouse template for a motion impaired user | Annette M. Crevasse, John A. Maze, Frank Miceli | 2003-02-11 |
| 6514123 | Semiconductor polishing pad alignment device for a polishing apparatus and method of use | Annette M. Crevasse, John A. Maze, Frank Miceli | 2003-02-04 |
| 6508363 | Slurry container | Annette M. Crevasse, John A. Maze, Frank Miceli | 2003-01-21 |
| 6462305 | Method of manufacturing a polishing pad using a beam | Annette M. Crevasse, Frank Miceli | 2002-10-08 |
| 6423149 | Apparatus and method for gradient cleaning of semiconductor wafers | Annette M. Crevasse, John A. Maze, Frank Miceli | 2002-07-23 |
| 6402599 | Slurry recirculation system for reduced slurry drying | Annette M. Crevasse, John A. Maze, Frank Miceli, Craig R. Zavilla | 2002-06-11 |
| 6373945 | Terminal block extension for greater wire packing efficiency | Dale Evans, John A. Maze, Frank Miceli, Jose Omar Rodriguez | 2002-04-16 |
| 6368955 | Method of polishing semiconductor structures using a two-step chemical mechanical planarization with slurry particles having different particle bulk densities | John A. Maze, Frank Miceli | 2002-04-09 |
| 6369799 | Computer pointer device for handicapped persons | Frank Miceli, John A. Maze | 2002-04-09 |
| 6368190 | Electrochemical mechanical planarization apparatus and method | John A. Maze, Frank Miceli | 2002-04-09 |
| 6354910 | Apparatus and method for in-situ measurement of polishing pad thickness loss | Richardson O. Adebanjo, Alvaro Maury, Frank Miceli, Jose Omar Rodriguez | 2002-03-12 |
| 6354928 | Polishing apparatus with carrier ring and carrier head employing like polarities | Annette M. Crevasse, John A. Maze, Frank Miceli | 2002-03-12 |
| 6355184 | Method of eliminating agglomerate particles in a polishing slurry | Annette M. Crevasse, John A. Maze, Sailesh Mansinh Merchant, Frank Miceli | 2002-03-12 |
| 6299519 | Apparatus and method for removing a polishing pad from a platen | John A. Maze, Frank Micelli | 2001-10-09 |
| 6293847 | Apparatus for chemical mechanical polishing endpoint detection using a hydrogen sensor | John A. Maze, Frank Miceli, Sudhanshu Misra, Allen Yen | 2001-09-25 |
| 6290883 | Method for making porous CMP article | Annette M. Crevasse, John A. Maze, Frank Miceli | 2001-09-18 |
| 6287173 | Longer lifetime warm-up wafers for polishing systems | Annette M. Crevasse, Alvaro Maury, John A. Maze, Frank Miceli | 2001-09-11 |
| 6288648 | Apparatus and method for determining a need to change a polishing pad conditioning wheel | John A. Maze, Frank Miceli, Yifeng Winston Yan | 2001-09-11 |
| 6281129 | Corrosion-resistant polishing pad conditioner | John A. Maze, Sailesh Mansinh Merchant | 2001-08-28 |
| 6264536 | Reducing polish platen corrosion during integrated circuit fabrication | Annette M. Crevasse, John A. Maze, Sailesh Mansinh Merchant, Frank Miceli | 2001-07-24 |
| 6258231 | Chemical mechanical polishing endpoint apparatus using component activity in effluent slurry | Sudhanshu Misra, Pradip K. Roy, Susan Clay Vitkavage | 2001-07-10 |
| 6254454 | Reference thickness endpoint techniques for polishing operations | John A. Maze, Frank Miceli | 2001-07-03 |
| 6234868 | Apparatus and method for conditioning a polishing pad | John A. Maze, Frank Miceli | 2001-05-22 |
| 6214732 | Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry | Sudhanshu Misra, Pradip K. Roy, Susan Clay Vitkavage | 2001-04-10 |