Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6206770 | Wafer carrier head for prevention of unintentional semiconductor wafer rotation | John A. Maze, Frank Miceli | 2001-03-27 |
| 6202295 | Method and tool that removes an electrical connecting block from a telecommunications board | Dale Evans, John A. Maze, Frank Miceli | 2001-03-20 |
| 6183652 | Method for removing microorganism contamination from a polishing slurry | Annette M. Crevasse, John A. Maze, Frank Miceli | 2001-02-06 |
| 6161278 | Method for inserting wires into a telephone jack connector | Dale Evans, John A. Maze, Frank Miceli | 2000-12-19 |
| 6150271 | Differential temperature control in chemical mechanical polishing processes | John A. Maze, Yaw S. Obeng | 2000-11-21 |
| 6121142 | Magnetic frictionless gimbal for a polishing apparatus | Annette M. Crevasse, John A. Maze | 2000-09-19 |
| 6093086 | Polishing head release mechanism | John A. Maze, Frank Miceli, Jose Omar Rodriguez | 2000-07-25 |
| 6080671 | Process of chemical-mechanical polishing and manufacturing an integrated circuit | Annette M. Crevasse, Brian D. Crevasse, John A. Maze | 2000-06-27 |
| 6059638 | Magnetic force carrier and ring for a polishing apparatus | Annette M. Crevasse, John A. Maze, Frank Micelli, Jose Omar Rodriguez | 2000-05-09 |
| 6024829 | Method of reducing agglomerate particles in a polishing slurry | John A. Maze | 2000-02-15 |
| 5967885 | Method of manufacturing an integrated circuit using chemical mechanical polishing | Annette M. Crevasse, John A. Maze, John Thomas Sowell | 1999-10-19 |
| 5951382 | Chemical mechanical polishing carrier fixture and system | Annette M. Crevasse, John A. Maze, John Thomas Sowell | 1999-09-14 |
| 5892292 | Getterer for multi-layer wafers and method for making same | — | 1999-04-06 |
| 5478758 | Method of making a getterer for multi-layer wafers | — | 1995-12-26 |
| 5366924 | Method of manufacturing an integrated circuit including planarizing a wafer | Richard Shanaman | 1994-11-22 |
| H1174 | Wafer bonded dielectrically isolated structures | Richard Shanaman | 1993-04-06 |
| H1137 | Wafer bonding technique for dielectric isolation processing | Richard Shanaman | 1993-02-02 |
| 4987471 | High-speed dielectrically isolated devices utilizing buried silicide regions | Anatoly Feygenson | 1991-01-22 |
| 4870029 | Method of forming complementary device structures in partially processed dielectrically isolated wafers | Daniel D. Leffel | 1989-09-26 |
| 4839309 | Fabrication of high-speed dielectrically isolated devices utilizing buried silicide outdiffusion | Anatoly Feygenson | 1989-06-13 |
| 4820653 | Technique for fabricating complementary dielectrically isolated wafer | Daniel D. Leffel | 1989-04-11 |