Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Akif Özkök, Bert Reents, Mustafa Özkök, Marko Mirkovic, Horst Brüggmann +2 more | 2024-08-13 |
| 9526183 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel +1 more | 2016-12-20 |
| 9445510 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel +1 more | 2016-09-13 |
| 8784634 | Electrolytic method for filling holes and cavities with metals | Bert Reents, Bernd Roelfs, Tafadzwa Magaya, Rene Wenzel, Soungsoo Kim | 2014-07-22 |