Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Akif Özkök, Soungsoo Kim, Herwig Josef BERTHOLD, Marcin Klobus +2 more | 2025-03-04 |
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Akif Özkök, Bert Reents, Mustafa Özkök, Marko Mirkovic, Markus Youkhanis +2 more | 2024-08-13 |
| 11015257 | Method and apparatus for electroplating a metal onto a substrate | Toshia Fujiwara, Roland Herold, Thomas Schiwon | 2021-05-25 |
| 10501860 | Method and apparatus for electroplating a metal onto a substrate | Toshia Fujiwara, Roland Herold, Thomas Schiwon | 2019-12-10 |