Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Akif Özkök, Bert Reents, Marko Mirkovic, Markus Youkhanis, Horst Brüggmann +2 more | 2024-08-13 |
| 8987910 | Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates | Gustavo Ramos, Arnd Kilian | 2015-03-24 |