Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Akif Özkök, Soungsoo Kim, Horst Brüggmann, Herwig Josef BERTHOLD +2 more | 2025-03-04 |
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Akif Özkök, Bert Reents, Mustafa Özkök, Markus Youkhanis, Horst Brüggmann +2 more | 2024-08-13 |