Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Soungsoo Kim, Horst Brüggmann, Herwig Josef BERTHOLD, Marcin Klobus +2 more | 2025-03-04 |
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Bert Reents, Mustafa Özkök, Marko Mirkovic, Markus Youkhanis, Horst Brüggmann +2 more | 2024-08-13 |
| 7872130 | Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit | Heiko Brunner, Wolfgang Dahms, Thomas Moritz, Udo Grieser | 2011-01-18 |