Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359332 | Copper electroplating bath | Sandra Heyde, Peter Haack, Angela Llavona-Serrano | 2025-07-15 |
| 11512405 | Metal or metal alloy deposition composition and plating compound | Angela Llavona-Serrano, Timo Bangerter, Olivier Mann, Pamela Cebulla, Stefanie ACKERMANN +2 more | 2022-11-29 |
| 11091849 | Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy | Josef Gaida, Jan SPERLING, Mauro CASTELLANI, Grigory VAZHENIN, Stefanie ACKERMANN +1 more | 2021-08-17 |
| 11066553 | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions | Lars Kohlmann, Agnieszka Witczak, Olivier Mann | 2021-07-20 |
| 10882842 | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths | Rangarajan Jagannathan, James Adolf, Jun Wu, Lars Kohlmann | 2021-01-05 |
| 10767275 | Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate | Lars Kohlmann, Agnieszka Witczak, Olivier Mann | 2020-09-08 |
| 10538850 | Electrolytic copper plating bath compositions and a method for their use | Dirk Rohde, Manuel Pölleth, Sven Rückbrod, Desthree Darwin, Sandra Niemann +1 more | 2020-01-21 |
| 10513780 | Plating bath composition and method for electroless plating of palladium | Andreas Walter, Christof Suchentrunk, Thomas Beck, Gerhard Steinberger, Holger Bera +1 more | 2019-12-24 |
| 10219391 | Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound | Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee | 2019-02-26 |
| 9909216 | Plating bath compositions for electroless plating of metals and metal alloys | Lars Kohlmann, Sengül KARASAHIN, Matthias Dammasch, Simon PAPE, Sandra Lucks | 2018-03-06 |
| 9790607 | 3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths | Klaus Schulz, Philip Hartmann, Philipp Wachter, Mike Briese, Richard Richter +1 more | 2017-10-17 |
| 9752244 | Galvanic nickel electroplating bath for depositing a semi-bright nickel | Klaus Schulz, Philip Hartmann, Philipp Wachter, Mike Briese, Richard Richter +1 more | 2017-09-05 |
| 9551080 | Copper plating bath composition | Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde +6 more | 2017-01-24 |
| 9504161 | Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound | Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee | 2016-11-22 |
| 9399824 | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys | Philip Hartmann, Klaus Schulz, Lars Kohlmann | 2016-07-26 |
| 9322107 | Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths | Lars Kohlmann, Ellen Habig, Björn Dingwerth, Lukas Bedrnik | 2016-04-26 |
| 9175399 | Plating bath for electroless deposition of nickel layers | Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod | 2015-11-03 |
| 8961670 | Alkaline plating bath for electroless deposition of cobalt alloys | Holger Bera | 2015-02-24 |
| 8828278 | Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA) | Torsten Voss, Joerg Schulze, Andreas Kirbs, Aylin Machmor, Bernd Froese +1 more | 2014-09-09 |
| 8679316 | Aqueous, acid bath and method for the electrolytic deposition of copper | Bernd Roelfs, Dirk Rohde, Thomas Pliet | 2014-03-25 |
| 8647491 | Pyrophosphate-based bath for plating of tin alloy layers | Philip Hartmann, Lars Kohlmann, Klaus Schulz | 2014-02-11 |
| 7872130 | Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit | Wolfgang Dahms, Thomas Moritz, Akif Özkök, Udo Grieser | 2011-01-18 |
| 7786303 | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds | Wolfgang Dahms, Udo Grieser | 2010-08-31 |