Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032914 | Method of forming a solderable solder deposit on a contact pad | Kai-Jens Matejat, Sven Lamprecht, Jan SPERLING | 2021-06-08 |
| 9551080 | Copper plating bath composition | Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann +6 more | 2017-01-24 |