Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9551080 | Copper plating bath composition | Heiko Brunner, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde +6 more | 2017-01-24 |
| 9526183 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-12-20 |
| 9506158 | Method for copper plating | Dirk Rohde, Jun Higuchi | 2016-11-29 |
| 9445510 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-09-13 |
| 8784634 | Electrolytic method for filling holes and cavities with metals | Bert Reents, Tafadzwa Magaya, Markus Youkhanis, Rene Wenzel, Soungsoo Kim | 2014-07-22 |
| 8679316 | Aqueous, acid bath and method for the electrolytic deposition of copper | Heiko Brunner, Dirk Rohde, Thomas Pliet | 2014-03-25 |