Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Akif Özkök, Soungsoo Kim, Horst Brüggmann, Herwig Josef BERTHOLD, Marcin Klobus +2 more | 2025-03-04 |
| 12063751 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Akif Özkök, Mustafa Özkök, Marko Mirkovic, Markus Youkhanis, Horst Brüggmann +2 more | 2024-08-13 |
| 9526183 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-12-20 |
| 9445510 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-09-13 |
| 8784634 | Electrolytic method for filling holes and cavities with metals | Bernd Roelfs, Tafadzwa Magaya, Markus Youkhanis, Rene Wenzel, Soungsoo Kim | 2014-07-22 |
| 7767065 | Device and method for electrolytically treating an at least superficially electrically conducting work piece | Reinhard Schneider, Stephan Kenny, Torsten Küssner, Wolfgang Plöse, Heribert Streup | 2010-08-03 |