Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526183 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-12-20 |
| 9445510 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel, Markus Youkhanis +1 more | 2016-09-13 |
| 8679316 | Aqueous, acid bath and method for the electrolytic deposition of copper | Heiko Brunner, Bernd Roelfs, Dirk Rohde | 2014-03-25 |
| 8507376 | Method to form solder deposits on substrates | Ingo Ewert, Sven Lamprecht, Kai-Jens Matejat | 2013-08-13 |