Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071702 | Acidic aqueous composition for electrolytic copper plating | Kun SI, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten +4 more | 2024-08-27 |
| 11091849 | Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy | Josef Gaida, Jan SPERLING, Mauro CASTELLANI, Grigory VAZHENIN, Stefanie ACKERMANN +1 more | 2021-08-17 |
| 11035051 | Acidic aqueous composition for electrolytic copper plating | Kun SI, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten +4 more | 2021-06-15 |
| 10793962 | Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy | Jan SPERLING, Stefan Pieper, Grigory VAZHENIN, Mauro CASTELLANI, Andreas Kirbs | 2020-10-06 |
| 10753007 | Process for indium or indium alloy deposition and article | Grigory VAZHENIN, Jan SPERLING, Stefan Pieper, Mauro CASTELLANI, Andreas Kirbs | 2020-08-25 |
| 10633755 | Copper plating bath composition and method for deposition of copper | Jens Palm | 2020-04-28 |
| 10538850 | Electrolytic copper plating bath compositions and a method for their use | Heiko Brunner, Manuel Pölleth, Sven Rückbrod, Desthree Darwin, Sandra Niemann +1 more | 2020-01-21 |
| 9551080 | Copper plating bath composition | Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann +6 more | 2017-01-24 |
| 9506158 | Method for copper plating | Bernd Roelfs, Jun Higuchi | 2016-11-29 |
| 8679316 | Aqueous, acid bath and method for the electrolytic deposition of copper | Heiko Brunner, Bernd Roelfs, Thomas Pliet | 2014-03-25 |
| 7026490 | Amorphous organic 1,3,2-dioxaborine luminophores, method for the production and use thereof | Horst Hartmann, Arvid Hunze, Andreas Kanitz, Wolfgang Rogler | 2006-04-11 |