Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071702 | Acidic aqueous composition for electrolytic copper plating | Kun SI, Ralf Schmidt, Onas Bolton, Frank Von Horsten, Dirk Rohde +4 more | 2024-08-27 |
| 12054843 | Acidic aqueous composition for electrolytically depositing a copper deposit | Ralf Schmidt, Willi Rohland, Jens Palm, Himendra Jha | 2024-08-06 |
| 11091849 | Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy | Jan SPERLING, Mauro CASTELLANI, Grigory VAZHENIN, Stefanie ACKERMANN, Heiko Brunner +1 more | 2021-08-17 |
| 11035051 | Acidic aqueous composition for electrolytic copper plating | Kun SI, Ralf Schmidt, Onas Bolton, Frank Von Horsten, Dirk Rohde +4 more | 2021-06-15 |
| 10619251 | Etching solution for copper and copper alloy surfaces | Fabian Michalik, Norbert Lützow, Thomas Hulsmann, Gabriela Schmidt | 2020-04-14 |
| 9076773 | Wire bondable surface for microelectronic devices | Albrecht Uhlig, Christof Suchentrunk | 2015-07-07 |
| 9057145 | Electrodeposition method with analysis of the electrolytic bath by solid phase extraction | Jürgen Barthelmes, Robert Rüther, Florence Lagorce-Broc, Olaf Kurtz, Oleg Sprenger +2 more | 2015-06-16 |
| 8986789 | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces | Albrecht Uhlig, Christof Suchentrunk, Michael Gerald Boyle, Brian Washo | 2015-03-24 |