Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11963308 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | Wonjin Cho, Toshio Honda, Dirk Tews, Markku LAGER, Felix Tang +4 more | 2024-04-16 |
| 10619251 | Etching solution for copper and copper alloy surfaces | Fabian Michalik, Josef Gaida, Thomas Hulsmann, Gabriela Schmidt | 2020-04-14 |
| 9441304 | Aqueous composition for etching of copper and copper alloys | Gabriela Schmidt, Dirk Tews | 2016-09-13 |