Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11963308 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | Norbert Lützow, Wonjin Cho, Toshio Honda, Markku LAGER, Felix Tang +4 more | 2024-04-16 |
| 10477700 | Method for manufacturing a printed circuit board | Wonjin Cho, Markku LAGER, Cedric Lin | 2019-11-12 |
| 9441304 | Aqueous composition for etching of copper and copper alloys | Norbert Lützow, Gabriela Schmidt | 2016-09-13 |
| 9332652 | Process for etching a recessed structure filled with tin or a tin alloy | Neal Wesley Denis Wood | 2016-05-03 |
| 8945298 | Non-etching non-resist adhesion composition and method of preparing a work piece | Christian Sparing, Norbert Luetzow, Martin Thoms | 2015-02-03 |
| 8758634 | Composition and method for micro etching of copper and copper alloys | Christian Sparing, Martin Thoms | 2014-06-24 |
| 8192636 | Composition and method for improved adhesion of polymeric materials to copper alloy surfaces | Christian Sparing | 2012-06-05 |