Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11963308 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | Norbert Lützow, Wonjin Cho, Toshio Honda, Dirk Tews, Markku LAGER +4 more | 2024-04-16 |
| 8945298 | Non-etching non-resist adhesion composition and method of preparing a work piece | Christian Sparing, Dirk Tews, Norbert Luetzow | 2015-02-03 |
| 8758634 | Composition and method for micro etching of copper and copper alloys | Dirk Tews, Christian Sparing | 2014-06-24 |