Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Akif Özkök, Horst Brüggmann, Herwig Josef BERTHOLD, Marcin Klobus +2 more | 2025-03-04 |
| 9526183 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel +1 more | 2016-12-20 |
| 9445510 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Bert Reents, Thomas Pliet, Bernd Roelfs, Toshiya Fujiwara, Rene Wenzel +1 more | 2016-09-13 |
| 8784634 | Electrolytic method for filling holes and cavities with metals | Bert Reents, Bernd Roelfs, Tafadzwa Magaya, Markus Youkhanis, Rene Wenzel | 2014-07-22 |