Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10077498 | Method for depositing a copper seed layer onto a barrier layer and copper plating bath | Matthias Dammasch, Marco HARYONO, Hans-Jürgen Schreier | 2018-09-18 |
| 9909216 | Plating bath compositions for electroless plating of metals and metal alloys | Heiko Brunner, Lars Kohlmann, Matthias Dammasch, Simon PAPE, Sandra Lucks | 2018-03-06 |