Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Akif Özkök, Soungsoo Kim, Horst Brüggmann, Herwig Josef BERTHOLD +2 more | 2025-03-04 |
| 11015257 | Method and apparatus for electroplating a metal onto a substrate | Toshia Fujiwara, Horst Brüggmann, Roland Herold | 2021-05-25 |
| 10501860 | Method and apparatus for electroplating a metal onto a substrate | Toshia Fujiwara, Horst Brüggmann, Roland Herold | 2019-12-10 |