Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8872329 | Extended landing pad substrate package structure and method | Ronald Patrick Huemoeller | 2014-10-28 |
| 8826531 | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers | Ronald Patrick Huemoeller, Sukianto Rusli | 2014-09-09 |
| 8802499 | Methods for temporary wafer molding for chip-on-wafer assembly | Michael Kelly, Ronald Patrick Huemoeller | 2014-08-12 |
| 8501543 | Direct-write wafer level chip scale package | Christopher J. Berry, Ronald Patrick Huemoeller | 2013-08-06 |
| 8440554 | Through via connected backside embedded circuit features structure and method | Ronald Patrick Huemoeller | 2013-05-14 |
| 8432022 | Shielded embedded electronic component substrate fabrication method and structure | Ronald Patrick Huemoeller, Brett Dunlap | 2013-04-30 |
| 8409658 | Conformal shielding process using flush structures | Waite R. Warren, Jr., David Jandzinski | 2013-04-02 |
| 8390130 | Through via recessed reveal structure and method | Ronald Patrick Huemoeller, Michael Kelly | 2013-03-05 |
| 8341835 | Buildup dielectric layer having metallization pattern semiconductor package fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2013-01-01 |
| 8324511 | Through via nub reveal method and structure | Ronald Patrick Huemoeller, Frederick Evans Reed, Kiwook Lee | 2012-12-04 |
| 8316536 | Multi-level circuit substrate fabrication method | Ronald Patrick Huemoeller, Russ Lie | 2012-11-27 |
| 8296941 | Conformal shielding employing segment buildup | Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin +5 more | 2012-10-30 |
| 8220145 | Isolated conformal shielding | Waite R. Warren, Jr. | 2012-07-17 |
| 8188584 | Direct-write wafer level chip scale package | Christopher J. Berry, Ronald Patrick Huemoeller | 2012-05-29 |
| 8176628 | Protruding post substrate package structure and method | Sukianto Rusli, Ronald Patrick Huemoeller | 2012-05-15 |
| 8110909 | Semiconductor package including top-surface terminals for mounting another semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2012-02-07 |
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2011-09-27 |
| 7977163 | Embedded electronic component package fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2011-07-12 |
| 7911037 | Method and structure for creating embedded metal features | Ronald Patrick Huemoeller, Sukianto Rusli, Nozad Karim | 2011-03-22 |
| 7723210 | Direct-write wafer level chip scale package | Christopher J. Berry, Ronald Patrick Huemoeller | 2010-05-25 |
| 7692286 | Two-sided fan-out wafer escape package | Ronald Patrick Huemoeller, Russ Lie | 2010-04-06 |
| 7670962 | Substrate having stiffener fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2010-03-02 |
| 7671457 | Semiconductor package including top-surface terminals for mounting another semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2010-03-02 |
| 7589398 | Embedded metal features structure | Ronald Patrick Huemoeller, Sukianto Rusli, Nozad Karim | 2009-09-15 |
| 7572681 | Embedded electronic component package | Ronald Patrick Huemoeller, Sukianto Rusli | 2009-08-11 |