Issued Patents All Time
Showing 76–88 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7548430 | Buildup dielectric and metallization process and semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2009-06-16 |
| 7501338 | Semiconductor package substrate fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli, Richard P. Sheridan | 2009-03-10 |
| 7420272 | Two-sided wafer escape package | Ronald Patrick Huemoeller, Russ Lie | 2008-09-02 |
| 7399661 | Method for making an integrated circuit substrate having embedded back-side access conductors and vias | Ronald Patrick Huemoeller, Sukianto Rusli | 2008-07-15 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2008-04-29 |
| 7361533 | Stacked embedded leadframe | Ronald Patrick Huemoeller, Sukianto Rusli | 2008-04-22 |
| 7247523 | Two-sided wafer escape package | Ronald Patrick Huemoeller, Russ Lie | 2007-07-24 |
| 7190062 | Embedded leadframe semiconductor package | Richard P. Sheridan, Ronald Patrick Huemoeller, Sukianto Rusli | 2007-03-13 |
| 7185426 | Method of manufacturing a semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2007-03-06 |
| 7145238 | Semiconductor package and substrate having multi-level vias | Ronald Patrick Huemoeller, Sukianto Rusli | 2006-12-05 |
| 7028400 | Integrated circuit substrate having laser-exposed terminals | Ronald Patrick Huemoeller, Sukianto Rusli | 2006-04-18 |
| 6930257 | Integrated circuit substrate having laminated laser-embedded circuit layers | Ronald Patrick Huemoeller, Sukianto Rusli | 2005-08-16 |
| 6747352 | Integrated circuit having multiple power/ground connections to a single external terminal | Ronald Patrick Huemoeller, Sukianto Rusli | 2004-06-08 |