Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8316536 | Multi-level circuit substrate fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2012-11-27 |
| 7692286 | Two-sided fan-out wafer escape package | Ronald Patrick Huemoeller, David Jon Hiner | 2010-04-06 |
| 7420272 | Two-sided wafer escape package | Ronald Patrick Huemoeller, David Jon Hiner | 2008-09-02 |
| 7247523 | Two-sided wafer escape package | Ronald Patrick Huemoeller, David Jon Hiner | 2007-07-24 |