Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014240 | Embedded component package and fabrication method | Ronald Patrick Huemoeller, Michael Kelly | 2018-07-03 |
| 9966300 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2018-05-08 |
| 9852976 | Semiconductor package and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand | 2017-12-26 |
| 9818684 | Electronic device with a plurality of redistribution structures having different respective sizes | Michael Kelly, Ronald Patrick Huemoeller, Young Rae Kim, JiYoung Chung, Minho Chang +1 more | 2017-11-14 |
| 9812386 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2017-11-07 |
| 9799592 | Semicondutor device with through-silicon via-less deep wells | Ronald Patrick Huemoeller, Michael Kelly | 2017-10-24 |
| 9704842 | Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package | Donghoon Lee, Dohyung Kim, Jungsoo Park, Seungchul Han, Joohyun Kim +2 more | 2017-07-11 |
| 9691635 | Buildup dielectric layer having metallization pattern semiconductor package fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2017-06-27 |
| 9653428 | Semiconductor package and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller | 2017-05-16 |
| 9627353 | Method of manufacturing a semiconductor package | Michael Kelly, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2017-04-18 |
| 9576917 | Embedded die in panel method and structure | Ronald Patrick Huemoeller, Curtis Zwenger, Corey Reichman | 2017-02-21 |
| 9553041 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2017-01-24 |
| 9543242 | Semiconductor package and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand | 2017-01-10 |
| 9462704 | Extended landing pad substrate package structure and method | Ronald Patrick Huemoeller | 2016-10-04 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2016-09-06 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2016-05-24 |
| 9324614 | Through via nub reveal method and structure | Ronald Patrick Huemoeller, Frederick Evans Reed, Kiwook Lee | 2016-04-26 |
| 9230883 | Trace stacking structure and method | Ronald Patrick Huemoeller, Harry Donald McCaleb, III, Michael DeVita | 2016-01-05 |
| 9159672 | Through via connected backside embedded circuit features structure and method | Ronald Patrick Huemoeller | 2015-10-13 |
| 9136159 | Method and system for a semiconductor for device package with a die-to-packaging substrate first bond | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2015-09-15 |
| 9129943 | Embedded component package and fabrication method | Ronald Patrick Huemoeller, Michael Kelly | 2015-09-08 |
| 9082833 | Through via recessed reveal structure and method | Ronald Patrick Huemoeller, Michael Kelly | 2015-07-14 |
| 9048298 | Backside warpage control structure and fabrication method | Ronald Patrick Huemoeller, Michael Kelly | 2015-06-02 |
| 9040349 | Method and system for a semiconductor device package with a die to interposer wafer first bond | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2015-05-26 |
| 8987050 | Method and system for backside dielectric patterning for wafer warpage and stress control | Ronald Patrick Huemoeller, Michael Kelly | 2015-03-24 |